The Park XE15 includes many unique capabilities that make it ideal for shared labs that handle a diverse range of samples, researchers doing multi variant experiments, and failure analysis engineers working on wafers. Its reasonable price and robust feature set also make it one of the best value large-sample AFMs in the industry.
Maximize your efficiency with the only AFM that offers the ability to image and measure multiple samples in one pass. Simply load the stage with your samples and initiate the scan process. This feature also allows you to scan the samples under identical environmental conditions, improving the accuracy and reliability of your data.
Unlike most AFMs, the Park XE15 can scan a sample of up to 150 mm x 150 mm. This makes it ideal for researchers wanting to scan larger samples or failure analysis engineers who need to place silicon wafers on the stage.
The Park XE15 features our most inclusive set of scan modes and can process a range of sample sizes. This makes it uniquely suited to shared labs with a wide range of individual requirements.
Using the motorized sample stage, MultiSample Scan™ enables programmable multiple region imaging in step-and-scan automation.
Here’s how it works:
1. Register multiple scan positions defined by a user
2. Image from the first scan position
3. Lift a cantilever
4. Move the motorized stage to the next user defined coordinate
5. Approach
6. Repeat scan
The registration of multiple scan positions are easily carried out by either entering sample-stage coordinates or sample de-skewing by two reference points. This automated feature greatly increases productivity by reducing the need for your interaction during the scan process.
Park Systems’ advanced Crosstalk Elimination (XE) scan system effectively addresses all of the above-mentioned problems. In this configuration, we used a 2-dimentional flexure stage to scan the sample in only the XY direction, and a stacked piezoelectric actuator to scan the probe cantilever in the Z direction only. The flexure stage used for the XY scanner is made of solid aluminum. It demonstrates high orthogonality and an excellent out-of-plane motion profile. The flexure stage can scan large samples (~1 kg) up to a few 100 Hz in the XY direction. This scan speed is sufficient because the bandwidth requirement for the XY axes is much lower than that for the Z axis. The stacked piezoelectric actuator for the Z-scanner has a high resonance frequency (~10 kHz) with a high pushpull force when appropriately pre-loaded.
Figure 9. Zero background curvature by Park Systems XE-system (a) and typical background curvature of a conventional AFM system with a tube scanner (b). (c) shows the cross section of these background curvatures.
Figure 9. shows unprocessed AFM images of a bare silicon wafer taken with the XE-system (a), and with a conventional AFM (b). Since the silicon wafer is atomically flat, most of the curvatures in the image are scanner-induced artifacts. Figure 9. (c) shows the cross section of the images in Figure 9. (a) and (b). Since the tube scanner has intrinsic background curvatures, the maximum out-of-plane motion is as much as 80 nm when the X-axis moves 15 μm. The XE scan system has less than 1nm of out-of-plane motion for the same scan range. Another advantage of the XE scan system is its Z-servo response. Figure 10. is an image of a porous polymer sphere (Styrene Divinyl Benzene), whose diameter is about 5 µm, taken with the XE-system in Non-Contact mode. Since the Z-servo response of the XE-system is very accurate, the probe can precisely follow the steep curvature of the polymer sphere as well as small porous surface structures without crashing or sticking to the surface. Figure 11. shows another example that demonstrates the high performance of the z-servo response with a flat background.
Figure 10. Figure 11.
In True Non-Contact™ Mode, the tip-sample distance is successfully maintained at a few nanometers in the net attractive regime of inter-atomic force. The small amplitude of tip oscillation minimizes the tip-sample interaction, resulting in superb tip preservation and negligible sample modification.
The sharp end of an AFM tip is so brittle that once it touches a sample, it becomes instantly blunt and limits the resolution of an AFM and reduces the quality of the image. For softer samples, the tip will damage the sample and also result in inaccuracies of sample height measurements. Consequently, preserving tip integrity enables consistent high resolution and accurate data. True Non-Contact Mode of theXE-AFM superbly preserves the tip, resulting in much longer tip life and less sample damageThe figure, displayed in 1:1 aspect ratio, shows the unprocessed raw data image of a shallow trench isolation sample imaged by the XE-AFM, whose depth is also confirmed by scanning electron microscope (SEM). The same tip used in the imaging of the sample shows no tip wear even after taking 20 images. 
Single-module flexure XY scanner with closed-loop control
Scan range : 100 µm × 100 µm
XY travel range : 150 mm × 150 mm, motorized
Z travel range : 25 mm
Focus travel range : 20 mm, motorized
Optional precision encoders for repeatable XY positioning
Guided high-force Z scanner
Scan range : 12 µm
25 µm (optional)
Sample size : Up to 150 mm
Thickness : Up to 20 mm
Direct on-axis vision of sample surface and cantilever
Coupled with 10× objective lens (20× optional)
Field-of-view : 480 × 360 µm
CCD : 1 Mpixel
Dedicated system control and data acquisition software
Adjusting feedback parameters in real time
Script-level control through external programs(optional)
AFM data analysis software (running on Windows, MacOS X, and Linux)
High performance DSP : 600 MHz with 4800 MIPS
Maximum 16 data images
Maximum data size : 4096 × 4096 pixels
Signal inputs : 20 channels of 16 bit ADC at 500 kHz samplings
Signal outputs : 21 channels of 16 bit DAC at 500 kHz settling
Synchronous signal : End-of-image, end-of-line, and end-of-pixel TTL signals
Active Q control (optional)
Cantilever spring constant calibration (optional)
CE Compliant
Power : 120 W
Signal Access Module (Optional)
True Non-Contact AFM
Basic Contact AFM
Lateral Force Microscopy (LFM)
Phase Imaging
Intermittent (tapping) AFM
Force Distance (FD) Spectroscopy
Force Volume Imaging
Electric Force Microscopy (EFM)
Dynamic Contact EFM (EFM-DC)
Piezoelectric Force Microscopy (PFM)
PFM with High Voltage
Force Modulation Microscopy (FMM)
Nanoindentation
Nanolithography
Nanolithography with High Voltage
Nanomanipulation
Piezoelectric Force Microscopy (PFM)
Magnetic Force Microscopy (MFM)
Tip-Enhanced Raman Spectroscopy (TERS)
Time-Resolved Photo Current Mapping (PCM)
Conductive AFM
IV Spectroscopy
Scanning Kelvin Probe Microscopy (SKPM/KPM)
SKPM with High Voltage
Scanning Capacitance Microscopy (SCM)
Scanning Spreading-Resistance Microscopy (SSRM)
Scanning Tunneling Microscopy (STM)
Time-Resolved Photo Current Mapping (PCM)
Chemical Force Microscopy with Functionalized Tip
Electrochemical Microscopy (EC-STM and EC-AFM)
Innovative control brings the system quickly to its temperature equilibrium
Temperature stability of less than 0.05 ºC within10 minutes of closing AE door
Includes an active vibration isolation system
The encoded XY stage travels in 1 µm resolution with 2 µm repeatability
The encoded Z stage travels in 0.1 µm resolution with 1 µm repeatability
Vacuum grooves to hold wafers
Sample dimension : Up to 150 mm
Z scan range : 25 µm
Resonant frequency : 1.7 kHz
Laser type : LD (650 nm) or SLD (830 nm)
Noise floor : 0.03 nm (typical), 0.05 nm (maximum)
Optical access : top and side
Z scan range : 12 µm or 25 µm
Laser type : LD (650 µm) or SLD (830 µm)
Noise floor : 0.03 nm (typical), 0.05 nm (maximum)
Resonant frequency : 3 kHz (12 µm XE Head), 1.7 kHz (25 µm XE Head)
Unmounted cantilever can be used
Tip bias range : -10 V to + 10 V
Tip bias function available for EFM and Conductive AFM
Support all the standard and advanced modes but STM, SCM, and in-liquid imaging
Enables access to various input/output signals for AFM
Scanner driving signal for the XY and Z scanners
Position signal for the XY and Z scanners
Cantilever deflection signals of the vertical/lateral direction
Bias signal for the sample and the cantilever
Driving signal for XE15
Auxiliary input signal to the system
Electrochemistry Cell
Universal Liquid Cell with Temperature Control
Sample Stages with Temperature Control
Magnetic Field Generator
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